Technic Inc. has released Pallaspeed 990, a new pure Palladium electroplating process for high-volume electronic applications. This, the company says, has proven to be a highly effective process, producing a high ductility/low stress bright deposit with no microcracking in thicknesses up to 4 µm.The process features a neutral pH with no ammonia smell, and offers a wide current density range with a stable electrolyte. The Pallaspeed 990 key characteristic is that the process incorporates a minimal amount of hydrogen during plating, which eliminates cracking of the deposit. Pallaspeed 990 is a fully analyzable process with simple UV/VIS procedures for additive control.  The process is reportedly stable with a greater than 5.0 metal turnover (MTO) bath life. Pallaspeed 990 is also claimed to offer superior corrosion resistance. With the high ductility of the deposit, the process is a recommended choice for mobile phone quick charge connectors and any situation where regular manual connectivity is required.